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#Solder preform free
Items indicated as qualifying for Select free delivery status apply only to ship locations in the 50 United States. If only some items in your order are eligible for Select Free Shipping, you will pay applicable shipping charges for the ineligible items.
It can also use SMT machines to paste parts to save manpower or avoid personnel errors.Items eligible for Select Free Shipping will be designated as such on their product pages. It is basically a piece of tin block extruded with solder, which can be used to make up for the shortcomings of insufficient amount of tin paste caused by the limitation of steel plate printing, and this kind of preformed tin sheet is generally made into tape and reel packaging (tape and reel). This kind of solder can be made into various shapes to meet different needs.
Sometimes The problem of insufficient amount of tin still occurs, so there is a so-called "Solder preforms" parts on the market.
However, the amount of solder that can be increased by this kind of steel plate is limited.
#Solder preform how to
How to use a thinner steel plate and partially increase the amount of tin? One method is to use "step-up & step-down stencil" to increase the amount of solder partially. In addition, some traditional plug-in (DIP) parts take For past-in-hole process, additional solder volume is also required. These parts still require a certain amount of tin solder to ensure the strength and quality of their welding. But not all parts can be reduced in size in this way, such as some Connectors such as telephone line jacks, network cable jacks, ATM card readers, etc. So the steel plate becomes thinner, from the most commonly used thickness of 0.18mm to the current 0.10mm. The smaller the size of these parts, the less tin they consume. Small chips have also been reduced from the original 1206 size to 0805, 0603, 0402, 0201 and almost the ultra size to 01005. Today's electronic parts are mostly made smaller and smaller. "Solder preforms" are small pieces of extruded tin that can be used to partially increase the amount of solder paste printed, help increase the limited amount of solder paste due to the use of steel plate printing, and improve the quality of solder.
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